Re: Meeting minutes

[Gerard Visser <gvisser@indiana.edu>]

Hi Dan,
	I finally got around to reading your minutes from last week...
	The nickel-flash then electroplate copper method is (I am guessing) 
probably related to the resistivity problem we had on that cathode 
sample that I was intending to measure capacitance on. I'm sorry if I'm 
stating the obvious but I assume you are taking the requirement to have 
a high sheet resistivity in the "no-copper" areas of the cathode into 
account in your deliberations with the material suppliers. Of course in 
the end this resistivity is a function of the base material and the 
etching or other patterning process - so maybe the material supplier 
alone will not have the full answer. You didn't mention this in your 
minutes -- I apologize if I am going over a point that has already been 
well discussed.
	The specification document you are preparing for the cathodes will of 
course include a minimum isolation resistance between adjacent strips, 
and name a specific test voltage, e.g., 50V, that shall be used to check 
it. Right?

	- Gerard

p.s. For the "tests of soldering to a dummy cathode boards (covered 
completely with Copper)" are you guys trying a Metcal soldering station? 
  Such a gadget can usually deal with soldering to even a very heavy 
ground plane using a fairly small tip such as 1/16" chisel...

Daniel S. Carman wrote:
> 
> Folks,
> 
> I have completed the minutes for our last FDC group meeting.  They
> are located on the wiki in the usual place at:
> 
> http://www.jlab.org/Hall-D/software/wiki/index.php/FDC_Meetings
> 
> Let me know if you have any questions or comments.
> 
> 
>                                 Regards,
> 
>                                         Daniel