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Power dissipation inside solenoid




Hi Tim,

I am trying to estimate the total amount of heat dissipated by electronics
inside the solenoid. The most confined space is for the FDC, which has
been the subject of most of the cooling studies. The CDC electronics is
located upstream and even though it is inside the magnet, there is open
space between the CDC and the UPV. This is also true for the upstream Bcal
electronics. The downstream Bcal electronics are a little more confined
by cabling obstructing the downstream openning of the magnet.

Estimate:

Assume 0.4 W per 8-ch ASIC chip. This is a fairly reliable estimate for
the chip.

CDC 3200 ch/8 x 0.4 W = 160 W
FDC 11,520 ch/8 x 0.4 W = 580 W

Assume 10 W per 16-ch SensL module. This is a guesstimate from Paul Smith
based on the cooling power of the 3x3 SiPM of 1 W.  It is probably correct
within a factor of 2.

Bcal upstream 3072/2 ch x 10 W/16 = 960 W
Bcal downstream 3072/2 ch x 10 W/10 = 960 W.

Alternative readout: If we assume the same number of channels (3072) and
16 channel segmentation of the planacon tubes, with a typical consumption
for the planacon divider of a few W, then the power dissipation would be
about 5 times lower. Carl can comment on the validity of this assumption.

Cheers, Elton.

Elton Smith
Jefferson Lab MS 12H5
12000 Jefferson Ave
Suite # 16
Newport News, VA 23606
elton@jlab.org
(757) 269-7625