- To: mitch@hep.upenn.edu
 
- Subject: 77419 T74LAB In Fab (GAS-1)
 
- From: The MOSIS Service <xmosis@mosis.com>
 
- Date: Wed, 9 May 2007 11:59:40 -0700 (PDT)
 
- In-reply-to: Secure web request from drl-dhcp102.sas.upenn.edu on 05-APR-2007 14:45:40
 
- Mosis-reply-id: 00273466-001-006
 
MOSIS run T74L containing design 77419 (GAS-1)
is now being fabricated.  Your Fab-ID is T74LAB.
The Fab-ID uniquely identifies your project on its wafer lot
and consists of two parts: the run (T74L) and the die (AB).
For status information concerning your project, please visit the URL
https://www.mosis.com/Webforms/project_status.html.
When the fabrication cycle is completed, MOSIS will ship your order
to you via FedEx International Priority service.
Project Warnings:
   93 text nodes ignored on layers: 18,59 (This warning indicates
      an anomaly in the file that does not compromise our
      processing of the data.)
   Unknown layer/datatype pairs found (NOTE: Unknown layers will
      NOT be fabricated; please verify each layer number in this
      list): 40/0, 41/0, 42/0, 44/0, 56/0, 104/1, 131/0, 132/0,
      158/0, 169/0
   The following export form has not been received and approved:
      - [ US Government Form BXA711 ]
      Designs lacking required export documentation will not be
      shipped. For further information see
      http://www.mosis.com/orders/purchase_orders/#payment.
   Final customer-supplied bonding diagram has not been received
      by MOSIS.
      
      Designs for which the final customer-supplied bonding
      diagram is not
      received in ample time for packaging will be shipped as
      unpackaged parts.
      
      For bonding diagram instructions and examples, please refer
      to:
      http://www.mosis.com/Technical/Packaging/pkg-intro.html#diagrams
Project Status:
   Design 77419 status: IN FAB
   Design name: GAS-1
   E-mail address: mitch@hep.upenn.edu
   Phone number: 215 898 4456
   Technology: TSMC25
   Requested (or default) fabrication options: STANDARD_METAL
   Fill to be added: by MOSIS
   Fabricated on run T74L (TSMC_025SPPM) as T74LAB.
   Bonding pads: 60 (plus 4 interior/non-bonding pads)
   Layout size: 4325 x 3168 microns; area: 13.702 sq millimeters
   Layers found (and densities): CONTACT, CTM (1.9%), DEEP_NWELL,
      METAL1 (32.0%), METAL2 (24.5%), METAL3 (21.2%), METAL4
      (38.7%), METAL5 (30.5%), N_PLUS_SELECT, N_WELL,
      PASSIVATION, POLY (13.1%), P_PLUS_SELECT, RPO, THIN_OXIDE,
      VIA, VIA2, VIA3, VIA4
   Requested quantity: 40
   Requested packaging: QFN64A [waiting for your bonding diagram;
      downbonds: None] (32 parts), UNPACKAGED (8 parts)
   Maximum die size: 6642 x 6642
   T74L is in fabrication; parts are expected to ship on
      20-JUN-2007.
   PO: 0000087100
   A total of 40 parts are ordered
   with 32 to be packaged in QFN64A
   with 8 to be delivered unpackaged
   The charge for project fabrication will be $27,331 per the
      MOSIS quote #142694-A.
   Please see
      http://www.mosis.com/Orders/submitting-pos.html#terms for
      information on payment terms and conditions.
   The project will be shipped to:
      Dr. J. PINFOLD   C/O SUZETTE CHAN
      UNIV. OF ALBERTA CENTRAL RECEIVING
      MATERIAL MGT. BUILDING CEB 445
      116 STREET & 85 AVENUE
      EDMOND AB  T6G 2R3
      CANADA
      
   Routing-label:
      <not yet specified>
   SPECIAL-HANDLING (received 05-APR-2007 14:59:06) DRC
Mosis-Reply-Id: 00273466-001-006
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