Re: Open Package Quote for production

[Mitch Newcomer <mitch@hep.upenn.edu>]

Hall D Electronics:

Sorry I seem to have missed your  $2600 quote and  recently got a quote 
for a  10X10 BGA that was  $2.80 each.  Clearly there is an economic 
advantage for the QFN64A at this point.   I'll take your message back to 
Sempac and see what they say.  I asked for 2500pcs in the quote.   For 
now though I'd like to stick with the open package for the MOSIS 
submission, even though it may cost something to  revise the chip layout 
on the  board.  It will get parts in our hands quickly that we can probe 
if necessary and the layout differences should be minor.
                                                                                                                                                     
Mitch

408 746 2800   - -
Fernando J. Barbosa wrote:
> Hi Mitch,
>
>    I noticed that the cost for this package (OP64 9x9) from Sempac is 
> about US$3 per package for large quantities which turns out to be 
> US$12,000 (I am assuming the Sempac quote includes bonding, etc.) The 
> quote I got from Sandy from I2A (QFN64 10x10) a few months ago put the 
> cost at US$2560 for 4000 units.

>
>    Do you agree we should increase the cost of the final chip 
> production estimates by about US$10,000?
>
> Thanks and best regards,
> Fernando
>
> Mitch Newcomer wrote:
>> Here is a quote for production packaging in the Open package  OC 
>> QFN64A that Mosis recommended.
>> Note that the lid is a necessary part here.    One obvious  benefit  
>> is that there is no NRE.    -- Mitch