GAS-1 ASICS arrived at Penn

[Mitch Newcomer <mitch@hep.upenn.edu>]

Hall D Electronics:

The order of 32 open cavity packages and 8 die from the TSMC process has 
arrived.
DVM measurements confirm expected connections, so bonding looks OK.  
The test socket should be fully wired by tomorrow afternoon and we have 
drawn up the list of  initial tests:
DC
Power Draw  by section
Input voltage/offsets
Output voltage/offsets
Pulse performance
Shape/Gain/ Dynamic range by channel
etc.

Hope to report initial findings by Friday.
                                                                     Mitch