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Re: Change of Shipping address



Hall D Electronics:

Hi Elton,
  The shipping address change came about because I noticed a typo in the 
original shipping address, 'Edmond' instead of 'Edmonton'. So I contacted 
our secretary, Suzette, and also asked her if Canadian GST tax would be 
applied to this order. She contacted Mitch who realized he wanted to look at 
the ASICs first anyway so he had the shipping address changed to UPenn. 
Since eight of the chips will be unpackaged, presumably so Mitch can check 
interior signals, they likely won't need to be sent on to anyone right away. 
About half of the remaining 32 packaged ASICs could be used to mount on FDC 
daughter boards for small scale FDC and CDC prototype testing. The question 
is whether this group of chips need to be tested before they are soldered to 
the boards. If there is enough confidence in the chips and you want to save 
time this is not a problem; there are more than a factor of two spare chips 
for this situation. The remaining packaged ASICs could be sent to Alberta 
for testing on a board with a test socket which allows testing without 
soldering to the board. Testing half the ASICs would take about two weeks 
plus shipping time. Since the delivery schedule from MOSIS has been shifted 
ahead by one month, there is less time to produce a test board. Perhaps 
Mitch and Fernando can confirm that the package and bonding diagram have 
been finalized.

John

    > Hall D Electronics:
> 
> HI Fernando,
> 
> I am a little confused. Will there be any testing at Alberta?
> 
> Thanks, Elton.
> 
> Elton Smith
> Jefferson Lab MS 12H5
> 12000 Jefferson Ave
> Suite # 16
> Newport News, VA 23606
> elton@jlab.org
> (757) 269-7625
> 
> On Thu, 10 May 2007, Fernando J. Barbosa wrote:
> 
> > Hi Mitch,
> >
> >     The BIS-711 export control form has been completed and faxed to Jim
> > Cousins at MOSIS.
> > The following is a tentative outline of the next steps:
> >
> > 1.    The chips will be shipped to you for testing.
> > 2.    After testing, these will be shipped to Jlab to be assembled onto
> > the preamp cards.
> > 3.    The preamp cards are being designed at Jlab for further tests on
> > the prototype FDC and CDC wire chambers.
> > 4.    I will circulate a test spec sheet that we can use for qualifying
> > the chips.
> >
> > Please let me know if there are other steps that need to be considered
> > at this time.
> >
> > Best regards,
> > Fernando
> >
> > Mitch Newcomer wrote:
> > >
> > > Design   77419  (GAS-1)
> > > Fab-ID is T74LAB
> > > PO: 0000087100
> > >
> > > RE>>>>The project will be shipped to:
> > >      Dr. J. PINFOLD   C/O SUZETTE CHAN
> > >      UNIV. OF ALBERTA CENTRAL RECEIVING
> > >      MATERIAL MGT. BUILDING CEB 445
> > >      116 STREET & 85 AVENUE
> > >      EDMOND AB  T6G 2R3
> > >
> > >
> > > Please ship all 40  parts to the following US address:
> > >           Mitch Newcomer
> > >           University of Pennsylvania
> > >           209 S 33rd St,
> > >           Philadelphia, PA  19104
> > >               These parts will be bench tested at Penn before assembly
> > > on boards
> > >
> > > Mitch Newcomer.
> > >
> >



John Schaapman                   Ph: 780-492-3043
Centre for Particle Physics     Fax: 780-492-3408
CEB-158
Mailstop #615
University of Alberta            
Edmonton, AB
CANADA       T6G 2G7